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NTD25P03L, STD25P03L
Power MOSFET
? 25 Amp, ? 30 Volt
Logic Level P ? Channel DPAK
Designed for low voltage, high speed switching applications and to
withstand high energy in the avalanche and commutation modes. The
http://onsemi.com
source ? to ? drain diode recovery time is comparable to a discrete fast
recovery diode.
Features
? S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC ? Q101 Qualified and
PPAP Capable
?
These Devices are Pb ? Free and are RoHS Compliant
V (BR)DSS
? 30 V
R DS(on) Typ
51 m W @ 5.0 V
P ? Channel
D
I D Max
? 25 A
Typical Applications
? PWM Motor Controls
? Power Supplies
? Converters
? Bridge Circuits
G
S
MARKING DIAGRAMS
& PIN ASSIGNMENTS
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Rating Symbol
Value
Unit
4
Drain
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
? Continuous
? Non ? Repetitive (tp ≤ 10 ms)
Drain Current
? Continuous @ T A = 25 ° C
? Single Pulse (t p ≤ 10 m s)
V DSS
V GS
V GSM
I D
I DM
? 30
" 15
" 20
? 25
? 75
V
V
Vpk
A
Apk
1 2
3
4
DPAK
CASE 369C
STYLE 2
1
Gate
2
Drain
3
Source
Total Power Dissipation @ T A = 25 ° C
P D
75
W
Operating and Storage Temperature Range
T J , T stg
? 55 to
+150
° C
4
4
Drain
Single Pulse Drain ? to ? Source Avalanche
Energy ? Starting T J = 25 ° C
(V DD = 25 Vdc, V GS = 5.0 Vdc,
Peak I L = 20 Apk, L = 1.0 mH, R G = 25 W )
Thermal Resistance
? Junction ? to ? Case
? Junction ? to ? Ambient (Note 1)
? Junction ? to ? Ambient (Note 2)
Maximum Lead Temperature for Soldering
Purposes, (1/8 in from case for 10 seconds)
E AS
R q JC
R q JA
R q JA
T L
200
1.65
67
120
260
mJ
° C/W
° C
1
2
3
DPAK ? 3
CASE 369D
STYLE 2
1 2 3
Gate Drain Source
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using 0.5 sq in pad size.
2. When surface mounted to an FR4 board using the minimum recommended
pad size.
Y = Year
WW = Work Week
25P03L = Device Code
G = Pb ? Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
? Semiconductor Components Industries, LLC, 2011
October, 2011 ? Rev. 4
1
Publication Order Number:
NTD25P03L/D
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